96 Failure Analysis Techniques for Rubber-to-Substrate Bonding

Thursday, October 11, 2012: 1:00 PM
Room 202-201 (Duke Energy Center)
Joshua Drab, Technical Service and Product R&D, LORD Corporation, Erie, PA
Rubber-to-substrate bonding is achieved with commercially available bonding agents that are designed to withstand the harsh environments that the end component may be exposed to during service.  Applications include anti-vibration components such as automotive and industrial engine mounts as well as suspension bushings, dynamic seals and gaskets, rubber rollers and wheels, reinforced goods (i.e., hose and belt) and many other rubber-to-substrate applications.  The main manufacturing processes include preparation of the substrate, bond agent application and vulcanization of the rubber.   Although monitoring of process and materials is an important task for adhesion quality, bond failures do occur from variation in materials and/or manufacturing process, and to a lesser degree from in-service issues.  Failure analysis techniques, or troubleshooting, typically employ a stepwise, practical approach.  First, background details are required to select the most appropriate method for analysis.  Second, failure analysis is completed with simple or complex scientific techniques.  Finally, the goal of failure analysis is to provide immediate corrective action and to help prevent future occurrences.  Utilizing best practice techniques, several case studies will be presented for this topic.