Session: Thursday Morning Session C: Adhesion to Reinforcements and Substrates (Fall 178th Technical Meeting)

Thursday Morning Session C: Adhesion to Reinforcements and Substrates

Thursday, October 14, 2010: 8:00 AM-10:45 AM

Co-chairs:

Andrew L. Tisler, Cytec Industries, Inc and Ed Terrill, Akron Rubber Development Laboratory

8:00 AM

The Use of Resorcinol and Resorcinol Formaldehyde Resins to Promote the Bonding of Rubber to Metal and Textile Reinforcements

Terry Dee, INDSPEC CHEMICAL CORP., Pittsburgh, PA

8:30 AM

Effect of Antiozonants on Rubber to Metal Adhesion

James R. Halladay and Patrick Warren, LORD Corporation, Erie, PA

9:00 AM

Morphological Study of the Rubber-Brass Adhesion Interphase

Akshay Ashirgade, University of Cincinnati, Cincinnati, OH and William Vanooij, Chemical and Materials Engineering, University of Cincinnati, Cincinnati, OH

9:30 AM

Break

9:45 AM

Better Rubber to Substrate Adhesion Via Better Interfacial Chemistry

Roger A. Cassell, Dow Advanced Materials, W. Alexandria, OH, Jing Jin, Ph, D, Dow Core R&D, Analytical Services, Dow Chemical Company, Midland, MI and Michaeleen Pacholski, Ph, D, Dow Central Analytical, Dow Chemical Company, Dow Chemical Company, Spring House, PA

10:15 AM

Characterization of Rubber-to-Metal Adhesives by Thermal Analysis

Michael Moore, Material Development, Freudenberg NOK General Partnership, Plymouth, MI and Swapnil Bondre, Components Division, Freudenberg NOK General Partnership, Bristol, NH