Characterization of Rubber-to-Metal Adhesives by Thermal Analysis

In order to optimize the rubber-to-metal bonding process, it is helpful to understand the cure parameters of both the rubber and the bonding agent.  In this paper, we will review methods of thermal analysis including differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA) and the suitability of each technique with respect to various classes of adhesives including phenolics, epoxies, silanes and covercoats.  We will also relate the cure characteristics determined by these methods to adhesive performance.