P-8
Investigating the Dynamic Properties Using a Moving Die Rubber Process Analyzer

Wednesday, October 15, 2014
Student Poster Session-Nashville Convention Center, Expo Floor (Nashville Convention Center)
Nischay Kodihalli Shivaprakash1, Joey Mead1, Carol F. Barry2, Artee Panwar3, John D.M. Shearer4 and John S. Dick5, (1)Plastics Engineering, University Of Massachusetts Lowell, Lowell, MA, (2)Plastics Engineering, University of Massachusetts Lowell, Lowell, MA, (3)Center for high-rate Nanomanufacturing, University of Massachusettes Lowell, Lowell, MA, (4)Center for high-rate Nanomanufacturing, University of Massachusetts, Lowell, Lowell, MA, (5)Alpha Technologies U.S., Akron, OH
Investigating the Dynamic Properties Using a Moving Die Rubber Process Analyzer

Nischay Kodihalli-Shivaprakash, John Shearer, Artee Panwar,Carol Barry, John Dick, Joey Mead

Developing rubber compounds with enhanced performance is important to meet the demands for superior material properties in a wide range of dynamic applications.  Changes in behavior as a function of strain are critical for most dynamic applications.  In this work, a rubber process analyzer was used to study both the Payne and Mullins effects in a silica-filled SBR compound.  This new approach allows the compounder to study the cure behavior and dynamic properties of the final compound simultaneously. 



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