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Enhancing Rubber-to-Substrate Bonding Performance with Chemlok® Adhesive Systems

Thursday, October 16, 2014: 2:45 PM
Session C-Rm #204 (Nashville Convention Center)
Jeffrey Means1, Mason Myers2 and Tejbans Singh Kohli2, (1)LORD Corporation, LORD Corporation, Erie, PA, (2)LORD Corporation, Erie, PA
In the rubber-to-substrate bonding industry, there are a variety of applications that require robust adhesion utilizing Chemlok®adhesive systems.  These applications include noise and vibration control devices, seals and gaskets, rubber rollers and wheels as well as many other bonded assemblies. In each of these applications, important process steps such as substrate preparation, elastomer molding, adhesive system selection, handling, and application are essential to producing quality rubber-to-substrate assemblies. 

This paper focuses on industry case studies that demonstrate the best practices for various aspects of rubber-to-substrate bonding.  Examples will be provided to highlight the proper techniques in each of the key processing areas of rubber-to-substrate bonding.