In-Mold Bonding of Fluorosilicone Onto Thermoplastic Substrates
Lord Corporation offers new technologies in IMB (in mold bonding) primers for overmolding of fluorosilicone rubber to a thermoplastic component. Mixing parts A&B of the primer and applying it to the thermoplastic component prepares the surface for bond formation. Overmolding a specially formulated fluorosilicone with added adhesion promoters provides optimal adhesive strength and is resistant to harsh environments.
A study of variables which include thermoplastic substrate type, application method, fluorosilicone grade, and conditions of curing the composite are compared. Comparisons are made in bond strength per ASTM D429 Method B (and other test methods) after exposure to heat, fuel swell, and water immersion. Surface structures of the bond formation are examined and considered as further detailed understanding of the chemical structure of the substrate-to-primer and primer-to-rubber interfaces.