Low Mold-Fouling Adhesive: Features and Bond Performance

Wednesday, October 12, 2016: 4:15 PM
Rm 306-7 (David L. Lawrence Convention Center )
Emmanuel Pitia, PhD, Elastomer Adhesive and Coating Technology, Lord Corporation, Erie, PA
Chemlok 6270 adhesive is a low mold-fouling rubber-to-substrate adhesive that also offers improved prebake and environmental resistance when used with an appropriate primer. A low mold-fouling adhesive improves productivity and efficiency by reducing down time, mold cleaning costs, and scrap.

Chemlok 6270 adhesive can be used in the manufacture of seals, gaskets, bushings, mounts, industrial tires, rolls and rollers, as well as seismic and bridge bearing pads. When used in combination with Chemlok primer, Chemlok 6270 adhesive bonds a variety of rubbers including natural rubber and nitrile to multiple substrates including aluminum, brass and grit blasted or zinc phosphatized steel.

The purpose of this paper is to demonstrate the benefits, features, and bond performance of Chemlok 6270 adhesive.