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New THIXON™ Primer and Cover Technology for Automotive Rubber-to-Substrate

Wednesday, October 15, 2014: 2:50 PM
Session A-Rm #206 (Nashville Convention Center)
Roger A. Cassell, PhD, Specialty Adhesives NAR/LAR, Dow Automotive Systems, West Alexandria, OH, Frank Billotto, Dow Automotive Systems, Specialty Adhesives Group, NAR, The Dow Chemical Company, Auburn Hills, MI and Dean Hoy, Dow Automotive Systems, Specialty Adhesives Group, The Dow Chemical Company, West Alexandria, OH
New THIXON™ Primer and Cover Technology for Automotive Rubber-to-Substrate Bonding

New THIXON P-21 primer and THIXON 526 cover adhesive technology enable primer and adhesive standardization and consolidation while meeting key industry requirements and providing well-balanced performance. 

The new technologies offer rubber-to-substrate adhesive users bonding versatility, a wide application process window and resistance to severe environmental exposures.  Additional benefits include:

  • REACH compliant multi-application primer with added flexibility
  • Dual purpose primer can be used as single coat adhesive for bonding polar elastomers
  • Enhanced prebake performance compared to competitive solutions
  • Robust performance against key industry performance requirements such as boiling water and salt spray exposures
  • Competitive industry solution with high-end grade bond strength

This presentation will focus on the new THIXON technology and will give an outlook into future adhesive development directions.



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