Hybrid Aqueous and Solvent Adhesive Systems for Rubber-to-Substrate Bonding

New emission, volatile organic compound (VOC), and hazardous air pollutant (HAP) regulations continue to affect the existing primers and adhesives that are currently available for rubber-to-substrate bonding.  These new regulations on primers and adhesives may allow for hybrid aqueous and solvent based systems to be used within the rubber-to-substrate bonding market without the implementation of an incineration unit.  This paper highlights the performance and implementation of a hybrid aqueous and solvent based Chemlok® adhesive system within a production environment.