Chemlok Adhesive Systems for Bonding Lightweight Substrates

Lightweight substrates, specifically engineered thermoplastics, are becoming more prevalent for industrial, aerospace, and automotive rubber-to-substrate bonding applications.  Most target applications include noise and vibration control devices such as mounts and bushings, however, many other bonding applications may be applicable.  In these bonding applications, the adhesive system plays an important role to maintain a robust bond during the service life of the end component. 

Engineered thermoplastics are appealing to the industry because of their physical and chemical properties including their ease of processing and lightweight attributes.  A lightweight attribute is important to the industry, as designers and engineers are challenged to reduce vehicle weight to meet future fuel efficiency demands.

This paper is a summary of performance data to include primary adhesion and environmental aging tests.  The data includes a variety of engineering thermoplastics, surface preparation techniques, adhesive systems and elastomer combinations.  The data was complied utilizing an ASTM International D429 Method B test plan.